DM5213 300 SLB (Microcircuit Memory) by Seeq Technology Inc - Request a Quote Now

Part No. : DM5213 300 SLB Alternate P/N : DM5213300SLB Manufacturer : Seeq Technology Inc
CAGE Code : 61394 Item Name : Microcircuit Memory FSC : 5962 Microcircuits Electronic
NSN : 5962-01-199-9161

You can send a request for quote for p/n DM5213 300 SLB to ASAP Semiconductor using justpartsunlimited.com. This part is manufactured by Seeq Technology Inc (CAGE Code 61394). The description of it is Microcircuit Memory. The national stock number associated with this part is NSN 5962011999161. This part belongs to FSC Microcircuits Electronic part family. An associate from ASAP Semiconductor will respond within 15 minutes to your query. It is our pleasure to help you with DM5213 300 SLB part requirements.

Required fields compulsory *

Contact Information

Note: We will not share your information to any third parties.

  * By clicking this box, I acknowledge that I have read and accept the ASAP Semiconductor Terms & Conditions and agree that all quotes and purchase orders are exclusively subject to the ASAP Semiconductor Terms and Conditions.

  • I consent to receive email communications from ASAP Semiconductor and can unsubscribe at any time.
  • ASAP Semiconductor is a wholly independent aftermarket parts distributor.
  • This website is intended for quotations based on part numbers only. Please DO NOT submit drawings, technical data, or other specifications through this portal.

Characteristics Data of NSN 5962-01-199-9161, 5962011999161

MRCCriteriaCharacteristic
ADAQBODY LENGTH1.290 INCHES MAXIMUM
ADATBODY WIDTH0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM
ADAUBODY HEIGHT0.210 INCHES MAXIMUM
AEHXMAXIMUM POWER DISSIPATION RATING855.0 MILLIWATTS
AFGAOPERATING TEMP RANGE-55.0/+125.0 DEG CELSIUS
AFJQSTORAGE TEMP RANGE-65.0/+125.0 DEG CELSIUS
AGAVEND ITEM IDENTIFICATIONRECEIVING SET,COUNTERMEASURES AN/ALR-56C
CBBLFEATURES PROVIDEDMONOLITHIC AND ERASABLE AND PROGRAMMABLE AND ELECTROSTATIC SENSITIVE AND W/ENABLE AND BIDIRECTIONAL
CQSJINCLOSURE MATERIALCERAMIC
CQSZINCLOSURE CONFIGURATIONDUAL-IN-LINE
CQWXOUTPUT LOGIC FORMN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
CQZPINPUT CIRCUIT PATTERN21 INPUT
CTFTCASE OUTLINE SOURCE AND DESIGNATORD-3 MIL-M-38510
CWSGTERMINAL SURFACE TREATMENTSOLDER
CZENVOLTAGE RATING AND TYPE PER CHARACTERISTIC-0.3 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE
CZEQTIME RATING PER CHACTERISTIC300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
CZERMEMORY DEVICE TYPEROM
CZZZMEMORY CAPACITYUNKNOWN
TESTTEST DATA DOCUMENT81413-201842 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWI
TTQYTERMINAL TYPE AND QUANTITY24 PRINTED CIRCUIT
ASAP Semiconductor's Certifications and Memberships