For competitive procurement options on part number PAL22V10-10 BLA from Advanced Micro Devices Inc (CAGE Code 34335), look no further than Just Parts Unlimited. With the form presented on this page, you can submit information on your needs to receive tailored procurement solutions from our staff.
Part Number PAL22V10-10 BLA Details:
Part number PAL22V10-10 BLA is manufactured by Advanced Micro Devices Inc and listed with the item name Microcircuit Memory. Classified under NSN 5962-01-384-7904, the NIIN of this item is 013847904, its INC is 41015, and its NCB code is 01 (USA).
For organization and identification purposes, this item is listed within the Federal Supply Group (FSG) 59 Electrical and Electronic Equipment Components and Class (FSC) 5962 Microcircuits Electronic. These details are important for confirming parts before making a purchase.
Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/terms-conditions.aspx . All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.
How to Get Started on Procurement
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-384-7904 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013847904 | 0 | N | D | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | D | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
5962-86053 | 5 | 1 | 4 |
MRC | Criteria | Characteristic |
---|---|---|
TTQY | Terminal Type And Quantity | 24 PRINTED CIRCUIT |
CTQX | Current Rating Per Characteristic | 200.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE |
CZER | Memory Device Type | PAL |
CBBL | Features Provided | BIDIRECTIONAL AND PROGRAMMED AND BIPOLAR AND HIGH IMPEDANCE AND ASYNCHRONOUS AND W/RESET |
AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
ADAT | Body Width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
CQZP | Input Circuit Pattern | 22 INPUT |
CQSJ | Inclosure Material | CERAMIC |
TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
MRC | Decoded Requirement | Clear Text Reply |
ADAQ | Body Length | 1.280 INCHES MAXIMUM |
AEHX | Maximum Power Dissipation Rating | 1.2 WATTS |
ADAU | Body Height | 0.185 INCHES MAXIMUM |
CZEN | Voltage Rating And Type Per Characteristic | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
CTFT | Case Outline Source And Designator | D-9 MIL-M-38510 |
CQSZ | Inclosure Configuration | DUAL-IN-LINE |
CXCY | Part Name Assigned By Controlling Agency | REGISTERED AND-OR GATE ARRAY |
AFGA | Operating Temp Range | -55.0/+125.0 DEG CELSIUS |
CWSG | Terminal Surface Treatment | SOLDER |
CZEQ | Time Rating Per Chacteristic | 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
CQWX | Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
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