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For competitive procurement options on part number AMPAL22V10ADC from Advanced Micro Devices Inc (CAGE Code 34335), look no further than Just Parts Unlimited. With the form presented on this page, you can submit information on your needs to receive tailored procurement solutions from our staff.
Part Number AMPAL22V10ADC Details:
Part number AMPAL22V10ADC is manufactured by Advanced Micro Devices Inc and listed with the item name Microcircuit Memory. Classified under NSN 5962-01-392-2825, the NIIN of this item is 013922825, its INC is 41015, and its NCB code is 01 (USA).
For organization and identification purposes, this item is listed within the Federal Supply Group (FSG) 59 Electrical and Electronic Equipment Components and Class (FSC) 5962 Microcircuits Electronic. These details are important for confirming parts before making a purchase.
Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/terms-conditions.aspx . All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.
How to Get Started on Procurement
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-392-2825 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013922825 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 5962-8753901LA | 5 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CZEQ | Time Rating Per Chacteristic | 25.00 NANOSECONDS MAXIMUM ACCESS |
| CZER | Memory Device Type | PAL |
| CQSJ | Inclosure Material | CERAMIC |
| MRC | Decoded Requirement | Clear Text Reply |
| CWSG | Terminal Surface Treatment | SOLDER |
| CQSZ | Inclosure Configuration | DUAL-IN-LINE |
| CBBL | Features Provided | HERMETICALLY SEALED AND PROGRAMMED |
| AFGA | Operating Temp Range | -55.0/+125.0 DEG CELSIUS |
| TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CTFT | Case Outline Source And Designator | D-9 MIL-M-38510 |
| TTQY | Terminal Type And Quantity | 24 PRINTED CIRCUIT |
| CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEN | Voltage Rating And Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
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