For competitive procurement options on part number AM27S37A BUA from Advanced Micro Devices Inc (CAGE Code 34335), look no further than Just Parts Unlimited. With the form presented on this page, you can submit information on your needs to receive tailored procurement solutions from our staff.
Part Number AM27S37A BUA Details:
Part number AM27S37A BUA is manufactured by Advanced Micro Devices Inc and listed with the item name Microcircuit Memory. Classified under NSN 5962-01-472-1949, the NIIN of this item is 014721949, its INC is 41015, and its NCB code is 01 (USA).
For organization and identification purposes, this item is listed within the Federal Supply Group (FSG) 59 Electrical and Electronic Equipment Components and Class (FSC) 5962 Microcircuits Electronic. These details are important for confirming parts before making a purchase.
Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/terms-conditions.aspx . All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.
How to Get Started on Procurement
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-472-1949 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 014721949 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
AM27S37A/BUA | 5 | 9 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
CZER | Memory Device Type | PROM |
CQSJ | Inclosure Material | CERAMIC |
TTQY | Terminal Type And Quantity | 32 LEADLESS |
CQSZ | Inclosure Configuration | LEADLESS FLAT PACK |
CXCY | Part Name Assigned By Controlling Agency | 8,192-BIT (1024X8 BIPOLAR REGISTERED PROM WITH PROGRAMMABLE INITIALIZE INPUT |
CBBL | Features Provided | SYNCHRONOUS AND 3-STATE OUTPUT AND LOW POWER AND W/SWITCH |
AFJQ | Storage Temp Range | -65.0 TO 150.0 DEG CELSIUS |
MRC | Decoded Requirement | Clear Text Reply |
FEAT | Special Features | 40 NS SETUP TIME/25 NS CLOCK-TO-OUTPUT |
AFGA | Operating Temp Range | -55.0 TO 125.0 DEG CELSIUS |
TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
AGAV | End Item Identification | F-15 |
CQWX | Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
CZEN | Voltage Rating And Type Per Characteristic | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
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