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For competitive procurement options on part number 185153 from Aeroflex Colorado Springs Inc (CAGE Code 65342), look no further than Just Parts Unlimited. With the form presented on this page, you can submit information on your needs to receive tailored procurement solutions from our staff.
Part Number 185153 Details:
Part number 185153 is manufactured by Aeroflex Colorado Springs Inc and listed with the item name Microcircuit Digital. Classified under NSN 5962-01-307-8889, the NIIN of this item is 013078889, its INC is 31779, and its NCB code is 01 (USA).
For organization and identification purposes, this item is listed within the Federal Supply Group (FSG) 59 Electrical and Electronic Equipment Components and Class (FSC) 5962 Microcircuits Electronic. These details are important for confirming parts before making a purchase.
Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/terms-conditions.aspx . All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.
How to Get Started on Procurement
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-307-8889 Item PartTypeName: MICROCIRCUIT,DIGITAL | 5962 | 013078889 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | U | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 185153 | 5 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND W/CLOCK |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 11 INPUT |
| ABKW | OVERALL HEIGHT | 0.260 INCHES MINIMUM AND 0.292 INCHES MAXIMUM |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| ADAU | BODY HEIGHT | 0.072 INCHES MINIMUM AND 0.088 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 300.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 85.0 DEG CELSIUS |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 COMBINER,CODE |
| ADAQ | BODY LENGTH | 1.088 INCHES MINIMUM AND 1.112 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 1.088 INCHES MINIMUM AND 1.112 INCHES MAXIMUM |
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