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For competitive procurement options on part number BCM5101C-4 from Allegro Microsystems Inc (CAGE Code 31019), look no further than Just Parts Unlimited. With the form presented on this page, you can submit information on your needs to receive tailored procurement solutions from our staff.
Part Number BCM5101C-4 Details:
Part number BCM5101C-4 is manufactured by Allegro Microsystems Inc and listed with the item name Microcircuit Memory. Classified under NSN 5962-01-130-8656, the NIIN of this item is 011308656, its INC is 41015, and its NCB code is 01 (USA).
For organization and identification purposes, this item is listed within the Federal Supply Group (FSG) 59 Electrical and Electronic Equipment Components and Class (FSC) 5962 Microcircuits Electronic. These details are important for confirming parts before making a purchase.
Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/terms-conditions.aspx . All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.
How to Get Started on Procurement
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-130-8656 Item Description: Microcircuit Memory | 5962 | 011308656 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | A | 0 | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Bcm5101c-4 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AGAV | END ITEM IDENTIFICATION | DATA LINK 76301 |
| ADAT | BODY WIDTH | 0.370 INCHES MINIMUM AND 0.400 INCHES MAXIMUM |
| CZEQ | TIME RATING PER CHACTERISTIC | 650.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| TTQY | TERMINAL TYPE AND QUANTITY | 22 PRINTED CIRCUIT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| ADAQ | BODY LENGTH | 1.060 INCHES MINIMUM AND 1.120 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND ELECTROSTATIC SENSITIVE AND W/ENABLE |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 0.3 VOLTS MINIMUM POWER SOURCE AND 7.3 VOLTS MAXIMUM POWER SOURCE |
| TEST | TEST DATA DOCUMENT | 13499-351-8489 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRA |
| CZER | MEMORY DEVICE TYPE | RAM |
| CRHL | (NON-CORE DATA) BIT QUANTITY | 1024 |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| ADAU | BODY HEIGHT | 0.185 INCHES MAXIMUM |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| CSWJ | (NON-CORE DATA) WORD QUANTITY | 256 |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
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