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For competitive procurement options on part number MHQ3467HXV from American Microsemiconductor Inc (CAGE Code 1S926), look no further than Just Parts Unlimited. With the form presented on this page, you can submit information on your needs to receive tailored procurement solutions from our staff.
Part Number MHQ3467HXV Details:
Part number MHQ3467HXV is manufactured by American Microsemiconductor Inc and listed with the item name Semiconductor Devic. Classified under NSN 5961-01-245-3669, the NIIN of this item is 012453669, its INC is 61962, and its NCB code is 01 (USA).
For organization and identification purposes, this item is listed within the Federal Supply Group (FSG) 59 Electrical and Electronic Equipment Components and Class (FSC) 5961 Semiconductor Devices and Associated Hardware. These details are important for confirming parts before making a purchase.
Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/terms-conditions.aspx . All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.
How to Get Started on Procurement
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-245-3669 Item PartTypeName: SEMICONDUCTOR DEVICES,UNITIZED | 5961 | 012453669 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 44-038313-01 | 3 | 8 | E |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | CERAMIC |
| ABHP | OVERALL LENGTH | 0.785 INCHES MAXIMUM |
| ABKW | OVERALL HEIGHT | 0.200 INCHES MAXIMUM |
| ABMK | OVERALL WIDTH | 0.325 INCHES MAXIMUM |
| ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-116 |
| ASKA | COMPONENT NAME AND QUANTITY | 4 TRANSISTOR |
| AXGY | MOUNTING METHOD | PRESS FIT |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED CASE |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL TRANSISTOR |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | -40.0 MAXIMUM COLLECTOR TO EMITTER VOLTAGE,DC AND-40.0 MAXIMUM COLLECTOR TO BASE VOLTAGE,DC AND-5.0 MAXIMUM EMITTER TO BASE VOLTAGE,DC ALL TRANSISTOR |
| CTQX | CURRENT RATING PER CHARACTERISTIC | -1.00 AMPERES MAXIMUM COLLECTOR CURRENT,DC ALL TRANSISTOR |
| CTRD | POWER RATING PER CHARACTERISTIC | 6.3 WATTS MAXIMUM TOTAL DEVICE DISSIPATION ALL TRANSISTOR |
| CTRK | TRANSFER RATIO | 20.0 MINIMUM STATIC FORWARD CURRENT TRANSFER RATIO,COMMON-EMITTER ALL TRANSISTOR |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 DEG CELSIUS AMBIENT AIR |
| FEAT | SPECIAL FEATURES | ALL TRANSISTOR JUNCTION PATTERN ARRANGEMENT: PNP |
| TTQY | TERMINAL TYPE AND QUANTITY | 14 UNINSULATED WIRE LEAD |
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