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For competitive procurement options on part number CSD124 from Chip Supply Inc (CAGE Code 57300), look no further than Just Parts Unlimited. With the form presented on this page, you can submit information on your needs to receive tailored procurement solutions from our staff.
Part Number CSD124 Details:
Part number CSD124 is manufactured by Chip Supply Inc and listed with the item name Semiconductor Devices Unitized. Classified under NSN 5961-01-351-0528, the NIIN of this item is 013510528, its INC is 61962, and its NCB code is 01 (USA).
For organization and identification purposes, this item is listed within the Federal Supply Group (FSG) 59 Electrical and Electronic Equipment Components and Class (FSC) 5961 Semiconductor Devices and Associated Hardware. These details are important for confirming parts before making a purchase.
Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/terms-conditions.aspx . All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.
How to Get Started on Procurement
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-351-0528 Item PartTypeName: SEMICONDUCTOR DEVICES,UNITIZED | 5961 | 013510528 | 0 | N | ||
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | A | |||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 60008 | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
| FEAT | SPECIAL FEATURES | ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN |
| AXGY | MOUNTING METHOD | TERMINAL |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PIN |
| ABBH | INCLOSURE MATERIAL | METAL |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 30.0 MAXIMUM NONREPETITIVE PEAK REVERSE VOLTAGE AND 30.0 MAXIMUM NONREPETITIVE PEAK OFF-STATE VOLTAGE ALL SEMICONDUCTOR DEVICE DIODE |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 DEG CELSIUS AMBIENT AIR |
| ABHP | OVERALL LENGTH | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| ABJT | TERMINAL LENGTH | 0.100 INCHES MINIMUM AND 0.165 INCHES MAXIMUM |
| ABKW | OVERALL HEIGHT | 0.200 INCHES MAXIMUM |
| ABMK | OVERALL WIDTH | 0.245 INCHES MINIMUM AND 0.271 INCHES MAXIMUM |
| ASKA | COMPONENT NAME AND QUANTITY | 10 SEMICONDUCTOR DEVICE DIODE |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES MAXIMUM PEAK FORWARD SURGE CURRENT ALL SEMICONDUCTOR DEVICE DIODE |
| CTRD | POWER RATING PER CHARACTERISTIC | 650.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION ALL SEMICONDUCTOR DEVICE DIODE |
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