For competitive procurement options on part number BU 61588P3 110 from Data Device Corporation (CAGE Code 0HYU1), look no further than Just Parts Unlimited. With the form presented on this page, you can submit information on your needs to receive tailored procurement solutions from our staff.
Part Number BU 61588P3 110 Details:
Part number BU 61588P3 110 is manufactured by Data Device Corporation and listed with the item name Microcircuit Hybrid. Classified under NSN 5962-01-642-0615, the NIIN of this item is 016420615, its INC is 41014, and its NCB code is 01 (USA).
For organization and identification purposes, this item is listed within the Federal Supply Group (FSG) 59 Electrical and Electronic Equipment Components and Class (FSC) 5962 Microcircuits Electronic. These details are important for confirming parts before making a purchase.
Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/terms-conditions.aspx . All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.
How to Get Started on Procurement
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-642-0615 Item PartTypeName: MICROCIRCUIT,HYBRID | 5962 | 016420615 | N | A | ||
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
A | A | 0 | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
BU-61588P3-110 | 5 | 2 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
ABHP | III OVERALL LENGTH | 25.4 MILLIMETERS NOMINAL |
ABKW | III OVERALL HEIGHT | 3.81 MILLIMETERS MAXIMUM |
ABMK | III OVERALL WIDTH | 25.4 MILLIMETERS NOMINAL |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | PIN GRID ARRAY |
CQZP | INPUT CIRCUIT PATTERN | 2 CHANNEL |
CSSL | DESIGN FUNCTION AND QUANTITY | 1 MEMORY, RANDOM ACCESS |
CWSG | TERMINAL SURFACE TREATMENT | TIN |
CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MINIATURE ADVANCED COMMUNICATION ENGINE |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL TOTAL SUPPLY |
CZES | HYBRID TECHNOLOGY TYPE | MULTICHIP |
CZZZ | MEMORY CAPACITY | 4K |
FEAT | SPECIAL FEATURES | INTEGRATES 2- 5-VOLT-ONLY TRANSCEIVERS, PROTOCOL, MEMORY MANAGEMENT, PROCESSOR INTERFACE LOGIC AND 4K X16 WORDS OF RAM IN A PIN GRID ARRAY; THIS ITEM IS AN IDEAL CHOICE FOR DEMANDING MILITARY AND INDUSTRIAL PROCESSOR-TO-1553 APPLICATIONS |
TTQY | TERMINAL TYPE AND QUANTITY | 81 PIN |
Guaranteed on-time delivery. |
|
Over 5100 manufacturers |
|
Customized and user-friendly database |
|
Complete purchasing solutions |
Thank You for Visiting! You Can Download the ASAP Semiconductor App On the Google Play Store and App Store to Get Updates On All of Our Latest Deals and Newest Parts.
Request for Quote