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For competitive procurement options on part number DPS 1X16-RB from Dpac Technologies Corp (CAGE Code 66847), look no further than Just Parts Unlimited. With the form presented on this page, you can submit information on your needs to receive tailored procurement solutions from our staff.
Part Number DPS 1X16-RB Details:
Part number DPS 1X16-RB is manufactured by Dpac Technologies Corp and listed with the item name Microcircuit Assembly. Classified under NSN 5962-01-356-6553, the NIIN of this item is 013566553, its INC is 33695, and its NCB code is 01 (USA).
For organization and identification purposes, this item is listed within the Federal Supply Group (FSG) 59 Electrical and Electronic Equipment Components and Class (FSC) 5962 Microcircuits Electronic. These details are important for confirming parts before making a purchase.
Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/terms-conditions.aspx . All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.
How to Get Started on Procurement
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-356-6553 Item PartTypeName: MICROCIRCUIT ASSEMBLY | 5962 | 013566553 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 205-0059-001 | 5 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.999 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.999 INCHES NOMINAL |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND RADIATION HARDENED AND STATIC OPERATION |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEM | MICROCIRCUIT DEVICE TYPE AND QUANTITY | 4 MEMORY |
| CZER | MEMORY DEVICE TYPE | RAM |
| ADAU | BODY HEIGHT | 0.170 INCHES NOMINAL |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| FEAT | SPECIAL FEATURES | NUCLEAR HARDNESS CRITICAL ITEMS |
| NHCF | NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |
| TTQY | TERMINAL TYPE AND QUANTITY | 31 PIN |
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