For competitive procurement options on part number BAS16 from Philips Circuit Assemblies (CAGE Code 25403), look no further than Just Parts Unlimited. With the form presented on this page, you can submit information on your needs to receive tailored procurement solutions from our staff.
Part Number BAS16 Details:
Part number BAS16 is manufactured by Philips Circuit Assemblies and listed with the item name Semiconductor Devic. Classified under NSN 5961-01-352-3496, the NIIN of this item is 013523496, its INC is 61962, and its NCB code is 01 (USA).
For organization and identification purposes, this item is listed within the Federal Supply Group (FSG) 59 Electrical and Electronic Equipment Components and Class (FSC) 5961 Semiconductor Devices and Associated Hardware. These details are important for confirming parts before making a purchase.
Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/terms-conditions.aspx . All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.
How to Get Started on Procurement
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-352-3496 Item PartTypeName: SEMICONDUCTOR DEVICES,UNITIZED | 5961 | 013523496 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
5322 130 31928 | 5 | 1 | C | A |
MRC | Criteria | Characteristic |
---|---|---|
ABJT | TERMINAL LENGTH | 0.018 INCHES MINIMUM AND 0.024 INCHES MAXIMUM |
ABBH | INCLOSURE MATERIAL | PLASTIC |
ABKW | OVERALL HEIGHT | 0.029 INCHES MINIMUM AND 0.037 INCHES MAXIMUM |
ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | SOT-23 |
ASKA | COMPONENT NAME AND QUANTITY | 3 SEMICONDUCTOR DEVICE DIODE |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 75.0 MAXIMUM BREAKDOWN VOLTAGE,DC ALL SEMICONDUCTOR DEVICE DIODE |
FEAT | SPECIAL FEATURES | ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN |
ABHP | OVERALL LENGTH | 0.110 INCHES MINIMUM AND 0.120 INCHES MAXIMUM |
ABMK | OVERALL WIDTH | 0.047 INCHES MINIMUM AND 0.055 INCHES MAXIMUM |
AXGY | MOUNTING METHOD | TERMINAL |
CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE |
CTQX | CURRENT RATING PER CHARACTERISTIC | 250.00 MILLIAMPERES MAXIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE ALL SEMICONDUCTOR DEVICE DIODE |
TTQY | TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD |
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