For competitive procurement options on part number BAV23T R from Philips Circuit Assemblies (CAGE Code 25403), look no further than Just Parts Unlimited. With the form presented on this page, you can submit information on your needs to receive tailored procurement solutions from our staff.
Part Number BAV23T R Details:
Part number BAV23T R is manufactured by Philips Circuit Assemblies and listed with the item name Semiconductor Devic. Classified under NSN 5961-01-507-0943, the NIIN of this item is 015070943, its INC is 61962, and its NCB code is 01 (USA).
For organization and identification purposes, this item is listed within the Federal Supply Group (FSG) 59 Electrical and Electronic Equipment Components and Class (FSC) 5961 Semiconductor Devices and Associated Hardware. These details are important for confirming parts before making a purchase.
Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/terms-conditions.aspx . All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.
How to Get Started on Procurement
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-507-0943 Item PartTypeName: SEMICONDUCTOR DEVICES,UNITIZED | 5961 | 015070943 | 0 | N | A | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | A | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
844470 | 5 | 9 | D |
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | PLASTIC |
ABHP | OVERALL LENGTH | 2.800 INCHES MINIMUM AND 3.000 INCHES MAXIMUM |
ABKW | OVERALL HEIGHT | 1.100 INCHES MAXIMUM |
ABMK | OVERALL WIDTH | 1.200 INCHES MINIMUM AND 1.400 INCHES MAXIMUM |
AGAV | END ITEM IDENTIFICATION | CP-1273/UPX-2 |
ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | SOT143 |
ASKA | COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE |
AXGY | MOUNTING METHOD | TERMINAL |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 250.0 MAXIMUM REPETITIVE PEAK REVERSE VOLTAGE ALL SEMICONDUCTOR AND 200.0 MAXIMUM REVERSE VOLTAGE, TOTAL RMS ALL SEMICONDUCTOR |
CTQX | CURRENT RATING PER CHARACTERISTIC | 625.00 MILLIAMPERES FORWARD CURRENT, AVERAGE BLANK ALL SEMICONDUCTOR |
CTRD | POWER RATING PER CHARACTERISTIC | 250.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR PRESET ALL SEMICONDUCTOR DEVICE DIODE |
FEAT | SPECIAL FEATURES | TERMINALS ARE GULLWING CONFIGURATION, SURFACE MOUNT |
TTQY | TERMINAL TYPE AND QUANTITY | 4 BONDING PAD |
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