For competitive procurement options on part number BBY39 from Philips Components Ltd (CAGE Code 0LUA3), look no further than Just Parts Unlimited. With the form presented on this page, you can submit information on your needs to receive tailored procurement solutions from our staff.
Part Number BBY39 Details:
Part number BBY39 is manufactured by Philips Components Ltd and listed with the item name Semiconductor Devices Unitized. Classified under NSN 5961-01-421-7012, the NIIN of this item is 014217012, its INC is 61962, and its NCB code is 01 (USA).
For organization and identification purposes, this item is listed within the Federal Supply Group (FSG) 59 Electrical and Electronic Equipment Components and Class (FSC) 5961 Semiconductor Devices and Associated Hardware. These details are important for confirming parts before making a purchase.
Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/terms-conditions.aspx . All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.
How to Get Started on Procurement
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-421-7012 Item PartTypeName: SEMICONDUCTOR DEVICES,UNITIZED | 5961 | 014217012 | 0 | N | A | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | A | A | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
5322 130 82199 | 5 | 2 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | PLASTIC" |
ABHP | OVERALL LENGTH | 3.0 MILLIMETERS MAXIMUM" |
ABKW | OVERALL HEIGHT | 1.1 MILLIMETERS MAXIMUM" |
ABMK | OVERALL WIDTH | 2.5 MILLIMETERS MAXIMUM" |
ASKA | COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE" |
AXGY | MOUNTING METHOD | TERMINAL" |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE" |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 30.0 NOMINAL REVERSE VOLTAGE, INSTANTANEOUS ALL SEMICONDUCTOR" |
CTRG | CAPACITANCE RATING IN PICOFARADS | 1.9 NOMINAL ALL SEMICONDUCTOR DEVICE DIODE" |
TTQY | TERMINAL TYPE AND QUANTITY | 3 PRINTED CIRCUIT" |
ABBH | INCLOSURE MATERIAL | PLASTIC" |
ABHP | OVERALL LENGTH | 3.0 MILLIMETERS MAXIMUM" |
ABKW | OVERALL HEIGHT | 1.1 MILLIMETERS MAXIMUM" |
ABMK | OVERALL WIDTH | 2.5 MILLIMETERS MAXIMUM" |
ASKA | COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE" |
AXGY | MOUNTING METHOD | TERMINAL" |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE" |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 30.0 NOMINAL REVERSE VOLTAGE, INSTANTANEOUS ALL SEMICONDUCTOR" |
CTRG | CAPACITANCE RATING IN PICOFARADS | 1.9 NOMINAL ALL SEMICONDUCTOR DEVICE DIODE" |
TTQY | TERMINAL TYPE AND QUANTITY | 3 PRINTED CIRCUIT" |
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