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For competitive procurement options on part number 74HC10D from Philips Semiconductors Ltd (CAGE Code 18324), look no further than Just Parts Unlimited. With the form presented on this page, you can submit information on your needs to receive tailored procurement solutions from our staff.
Part Number 74HC10D Details:
Part number 74HC10D is manufactured by Philips Semiconductors Ltd and listed with the item name Microcircuit Digital. Classified under NSN 5962-01-374-6010, the NIIN of this item is 013746010, its INC is 31779, and its NCB code is 01 (USA).
For organization and identification purposes, this item is listed within the Federal Supply Group (FSG) 59 Electrical and Electronic Equipment Components and Class (FSC) 5962 Microcircuits Electronic. These details are important for confirming parts before making a purchase.
Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/terms-conditions.aspx . All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.
How to Get Started on Procurement
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-374-6010 Item PartTypeName: MICROCIRCUIT,DIGITAL | 5962 | 013746010 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 74HC10D | 2 | 9 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| TTQY | Terminal Type And Quantity | 14 PRINTED CIRCUIT |
| CQZP | Input Circuit Pattern | TRIPLE 3 INPUT |
| AFGA | Operating Temp Range | -40.0/+85.0 DEG CELSIUS |
| CQSJ | Inclosure Material | PLASTIC |
| CSSL | Design Function And Quantity | 3 GATE, NAND |
| CBBL | Features Provided | HIGH SPEED AND COMPATIBLE CMOS |
| ADAT | Body Width | 3.800 INCHES MINIMUM AND 4.000 INCHES MAXIMUM |
| FEAT | Special Features | SMALL OUTLINE PACKAGE |
| ADAQ | Body Length | 8.550 INCHES MINIMUM AND 8.750 INCHES MAXIMUM |
| CZEN | Voltage Rating And Type Per Characteristic | 2.0 VOLTS MINIMUM APPLIED AND 6.0 VOLTS MAXIMUM APPLIED |
| ADAU | Body Height | 1.350 INCHES MINIMUM AND 1.750 INCHES MAXIMUM |
| CTFT | Case Outline Source And Designator | DH1 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| AGAV | End Item Identification | 6625-01-286-3566 E/I FSCM 03950 |
| CXCY | Part Name Assigned By Controlling Agency | TRIPLE 3-INPUT NAND GATE |
| CQSZ | Inclosure Configuration | DUAL-IN-LINE |
| CWSG | Terminal Surface Treatment | SOLDER |
| MRC | Decoded Requirement | Clear Text Reply |
| AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
| CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
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