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For competitive procurement options on part number BAS21LT1 from Semiconductor Components Industries (CAGE Code 1MQ07), look no further than Just Parts Unlimited. With the form presented on this page, you can submit information on your needs to receive tailored procurement solutions from our staff.
Part Number BAS21LT1 Details:
Part number BAS21LT1 is manufactured by Semiconductor Components Industries and listed with the item name Semiconductor Devic. Classified under NSN 5961-01-480-5683, the NIIN of this item is 014805683, its INC is 20589, and its NCB code is 01 (USA).
For organization and identification purposes, this item is listed within the Federal Supply Group (FSG) 59 Electrical and Electronic Equipment Components and Class (FSC) 5961 Semiconductor Devices and Associated Hardware. These details are important for confirming parts before making a purchase.
Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/terms-conditions.aspx . All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.
How to Get Started on Procurement
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-480-5683 Item PartTypeName: SEMICONDUCTOR DEVICE,DIODE | 5961 | 014805683 | 0 | N | A | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | A | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| BAS21LT1 | 5 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | CERAMIC |
| ABMK | OVERALL WIDTH | 2.500 MILLIMETERS MAXIMUM |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 200.00 MILLIAMPERES SOURCE CUTOFF CURRENT PRESET AND 625.00 MILLIAMPERES REPETITIVE PEAK FORWARD CURRENT UNIVERSAL |
| CTRG | CAPACITANCE RATING IN PICOFARADS | 5.0 MAXIMUM |
| TTQY | TERMINAL TYPE AND QUANTITY | 3 TAB, SOLDER LUG |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS JUNCTION AND -55.0 DEG CELSIUS JUNCTION |
| AKPV | MOUNTING FACILITY QUANTITY | 3 |
| ABHP | OVERALL LENGTH | 3.040 MILLIMETERS MAXIMUM |
| ABJT | TERMINAL LENGTH | 2.040 MILLIMETERS MAXIMUM |
| ABKW | OVERALL HEIGHT | 1.110 MILLIMETERS MAXIMUM |
| AXGY | MOUNTING METHOD | COMPRESSION |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 250.0 MAXIMUM REVERSE VOLTAGE, INSTANTANEOUS |
| CTRD | POWER RATING PER CHARACTERISTIC | 225.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-EMITTER PEAK |
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