For competitive procurement options on part number SES729 from Semitronics Corp (CAGE Code 31338), look no further than Just Parts Unlimited. With the form presented on this page, you can submit information on your needs to receive tailored procurement solutions from our staff.
Part Number SES729 Details:
Part number SES729 is manufactured by Semitronics Corp and listed with the item name Semiconductor Devic. Classified under NSN 5961-01-400-1651, the NIIN of this item is 014001651, its INC is 33096, and its NCB code is 01 (USA).
For organization and identification purposes, this item is listed within the Federal Supply Group (FSG) 59 Electrical and Electronic Equipment Components and Class (FSC) 5961 Semiconductor Devices and Associated Hardware. These details are important for confirming parts before making a purchase.
Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/terms-conditions.aspx . All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.
How to Get Started on Procurement
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-400-1651 Item PartTypeName: SEMICONDUCTOR DEVICE,THYRISTOR | 5961 | 014001651 | 0 | N | A | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | A | A | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
10133499 | 5 | 9 | 6 |
MRC | Criteria | Characteristic |
---|---|---|
ABHP | OVERALL LENGTH | 16.89 MILLIMETERS MAXIMUM |
ABMK | OVERALL WIDTH | 16.38 MILLIMETERS MAXIMUM |
ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-257AA |
CTMZ | III SEMICONDUCTOR MATERIAL | SILICON |
CTQX | CURRENT RATING PER CHARACTERISTIC | 12.00 AMPERES FORWARD CURRENT, TOTAL RMS HORSEPOWER METRIC AND 100.00 AMPERES PEAK FORWARD SURGE CURRENT NANOAMPERES |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 DEG CELSIUS JUNCTION |
TTQY | TERMINAL TYPE AND QUANTITY | 3 PIN |
ABBH | INCLOSURE MATERIAL | METAL |
ABKW | OVERALL HEIGHT | 5.08 MILLIMETERS MAXIMUM |
AKPV | MOUNTING FACILITY QUANTITY | 1 |
AXGY | MOUNTING METHOD | UNTHREADED HOLE |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 200.0 MAXIMUM REPETITIVE PEAK REVERSE VOLTAGE AND 200.0 MAXIMUM REPETITIVE PEAK OFF-STATE VOLTAGE |
CTRD | POWER RATING PER CHARACTERISTIC | 20.0 WATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR BLANK AND 0.5 WATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR UNIVERSAL |
TEST | TEST DATA DOCUMENT | 82577-H8000313 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRA |
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