AS9120B, ISO 9001:2015, and FAA AC 0056B Accredited
For competitive procurement options on part number MKB4118P-83 from St Microelectronics Ltd (CAGE Code 50088), look no further than Just Parts Unlimited. With the form presented on this page, you can submit information on your needs to receive tailored procurement solutions from our staff.
Part Number MKB4118P-83 Details:
Part number MKB4118P-83 is manufactured by St Microelectronics Ltd and listed with the item name Microcircuit Memory. Classified under NSN 5962-01-113-7050, the NIIN of this item is 011137050, its INC is 41015, and its NCB code is 01 (USA).
For organization and identification purposes, this item is listed within the Federal Supply Group (FSG) 59 Electrical and Electronic Equipment Components and Class (FSC) 5962 Microcircuits Electronic. These details are important for confirming parts before making a purchase.
Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/terms-conditions.aspx . All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.
How to Get Started on Procurement
| MRC | Criteria | Characteristic |
|---|---|---|
| CZEQ | Time Rating Per Chacteristic | 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
| CQZP | Input Circuit Pattern | 18 INPUT |
| TEST | Test Data Document | 13973-839201-0018 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| CQSJ | Inclosure Material | CERAMIC |
| MRC | Decoded Requirement | Clear Text Reply |
| TTQY | Terminal Type And Quantity | 24 PRINTED CIRCUIT |
| ADAT | Body Width | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| CBBL | Features Provided | HERMETICALLY SEALED AND MONOLITHIC AND 3-STATE OUTPUT AND PROGRAMMABLE AND PROGRAMMED |
| CWSG | Terminal Surface Treatment | SOLDER |
| ADAQ | Body Length | 1.290 INCHES MAXIMUM |
| AEHX | Maximum Power Dissipation Rating | 1.0 WATTS |
| ADAU | Body Height | 0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM |
| CTFT | Case Outline Source And Designator | D-3 MIL-M-38510 |
| AFGA | Operating Temp Range | +0.0/+70.0 DEG CELSIUS |
| CQSZ | Inclosure Configuration | DUAL-IN-LINE |
| CZER | Memory Device Type | RAM |
| CZEN | Voltage Rating And Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CQWX | Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
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