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For competitive procurement options on part number WS57C49-70CMB from Waferscale Integration Inc (CAGE Code 66579), look no further than Just Parts Unlimited. With the form presented on this page, you can submit information on your needs to receive tailored procurement solutions from our staff.
Part Number WS57C49-70CMB Details:
Part number WS57C49-70CMB is manufactured by Waferscale Integration Inc and listed with the item name Microcircuit Memory. Classified under NSN 5962-01-320-2539, the NIIN of this item is 013202539, its INC is 41015, and its NCB code is 01 (USA).
For organization and identification purposes, this item is listed within the Federal Supply Group (FSG) 59 Electrical and Electronic Equipment Components and Class (FSC) 5962 Microcircuits Electronic. These details are important for confirming parts before making a purchase.
Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/terms-conditions.aspx . All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.
How to Get Started on Procurement
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-320-2539 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013202539 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 10133802 | 5 | 9 | 6 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAT | BODY WIDTH | 11.23 MILLIMETERS MINIMUM AND 11.68 MILLIMETERS MAXIMUM |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| ADAU | BODY HEIGHT | 1.52 MILLIMETERS MINIMUM AND 2.54 MILLIMETERS MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 LEADLESS |
| ADAQ | BODY LENGTH | 11.23 MILLIMETERS MINIMUM AND 11.68 MILLIMETERS MAXIMUM |
| CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-4 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 120.00 MILLIAMPERES MAXIMUM SUPPLY |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | EPROM |
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