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For competitive procurement options on part number WS27C512L-12CMB from Waferscale Integration Inc (CAGE Code 66579), look no further than Just Parts Unlimited. With the form presented on this page, you can submit information on your needs to receive tailored procurement solutions from our staff.
Part Number WS27C512L-12CMB Details:
Part number WS27C512L-12CMB is manufactured by Waferscale Integration Inc and listed with the item name Microcircuit Memory. Classified under NSN 5962-01-372-9627, the NIIN of this item is 013729627, its INC is 41015, and its NCB code is 01 (USA).
For organization and identification purposes, this item is listed within the Federal Supply Group (FSG) 59 Electrical and Electronic Equipment Components and Class (FSC) 5962 Microcircuits Electronic. These details are important for confirming parts before making a purchase.
Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/terms-conditions.aspx . All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.
How to Get Started on Procurement
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-372-9627 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013729627 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 5962-87648 | 5 | 1 | 4 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CTQX | Current Rating Per Characteristic | 60.00 MILLIAMPERES MAXIMUM SUPPLY |
| CBBL | Features Provided | BURN IN AND MONOLITHIC AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE |
| AFJQ | Storage Temp Range | -65.0 TO 150.0 DEG CELSIUS |
| CQZP | Input Circuit Pattern | 24 INPUT |
| CQSJ | Inclosure Material | CERAMIC |
| ADAT | Body Width | 0.485 INCHES MINIMUM AND 0.495 INCHES MAXIMUM |
| TTQY | Terminal Type And Quantity | 32 LEADLESS |
| ADAQ | Body Length | 0.585 INCHES MINIMUM AND 0.595 INCHES MAXIMUM |
| AEHX | Maximum Power Dissipation Rating | 350.0 MILLIWATTS |
| ADAU | Body Height | 0.140 INCHES MINIMUM AND 0.167 INCHES MAXIMUM |
| TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| MRC | Decoded Requirement | Clear Text Reply |
| CTFT | Case Outline Source And Designator | C-12 MIL-M-38510 |
| CQSZ | Inclosure Configuration | LEADLESS FLAT PACK |
| AFGA | Operating Temp Range | -55.0 TO 125.0 DEG CELSIUS |
| CWSG | Terminal Surface Treatment | SOLDER |
| CZEN | Voltage Rating And Type Per Characteristic | 6.25 VOLTS MAXIMUM POWER SOURCE |
| CZER | Memory Device Type | EPROM |
| CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
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